We are happy about a successful European Microwave Week in Berlin from 17 – 22 September 2023. The 6G-RIC team works to lay the scientific and technical foundations across all technology levels, from radio access to core networks and fiber optic transport networks. At the 6G-RIC booth, we exhibited the following:
DEMOS
- Direction-resolved sub-THz channel sounding in D-band, HHI
- RRAM: The technology enabler for high-performance and energy-efficient systems, IHP
CHIPS
- Samples of hetero-integration process (InP-on-BiCMOS), FBH & IHP
- 44 GHz-BW 18.5 GS/s sampling front-end & 150 GHz low noise amplifier in 22 nm CMOS FDSOI, TU Berlin
BOARDS / COMPONENTS / SETUPS
- D-band fully integrated bidirectional phased array, IHP
- 20 GHz VCO in 22 nm FDX & x8 frequency multiplier chain with LO buffer up to 20 GHz in BiCMOS, TU Braunschweig
- W-band beam switching transmitter, W/D-band waveguide components, FR2 “Virtual Circular Array Antenna”, HHI
Kudos to our amazing team: Michael Peter, Slawomir Stanczak, Ramez Askar, Mathis Schmieder, Sven Wittig, Alper Schultze, Niclas Kullig, Elena Kempf-Loeck, Jelena, Murašova, Karthik Krishnegowda, Christoph Herold and Markus Fritscher about the project’s state-of-the-art research & technology. Thanks to our project partners IHP, Technische Universität Berlin, Ferdinand-Braun-Institute, Fraunhofer IAF and Technische Universität Braunschweig! 6G-RIC is funded by the Bundesministerium für Bildung und Forschung.
Follow us on our journey towards sustainable and secure 6G technologies, and meet us again during IEEE @GLOBECOM 2023.
